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Kandou raises USD 75 Million to launch mass production of its chips


21 December 2021

Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions based in Lausanne, raised USD 75 million in a Series D financing round. The investment will support the launch of its first silicon product and the ongoing development of its signaling technology.

Based on fundamental advances in interconnect technology that lower power consumption and improve the performance of chip links, Kandou offers disruptive technology through licensing and standard products for smaller, more energy efficient and cost-effective electronic devices.

Proceeds from Series D financing round will be used to ramp production of Kandou‘s first silicon product known as Matterhorn, a USB-C multiprotocol retimer solution with USB4 support for consumer and networking applications for electronic devices. Funds also will be used for ongoing development of product and technology roadmaps, including new silicon products and Chord signaling intellectual property (IP) for ultra-short reach and long-reach signaling applications.

The total investment in Kandou to date is  USD 207.8 million from new and existing investors including Bessemer Venture Partners and DC Investment Partners.

“This round of funding will enable us to meet the demand for Matterhorn from customers while we continue to innovate and deliver high-speed connectivity solutions,” said Amin Shokrollahi, Founder and CEO of Kandou. “We thank Bessemer Venture Partners for their ongoing commitment to us and welcome new Kandou investors participating in this round.”

Founded in 2011 as an EPFL spin-off, Kandou is headquartered in Lausanne (canton of Vaud), with offices in Europe, North America and Asia.