Data protection Impressum

Engineering

Spun out of EPFL in 2011, Kandou designs high speed, energy efficient serial links connecting Integrated Circuit components such as processor and memory, or processor and processor.

Kandou secures USD 72 million launch its new game-changing product

20 September 2023

Top Stories Western Switzerland

Top Stories from Western Switzerland (April-June 2023)

3 July 2023

BFH-TI: innovative education tailored to industry expectations

CSEM will help develop 3D-printed pipes for CERN particle detectors and the International Space Station

27 September 2022

EPFL and CSEM’s tandem solar cells set two world records

11 July 2022

Clexbio and CSEM join forces to develop the first device to produce vein implants

5 July 2022

“Switzerland is an open door to the world”

28 June 2022

An ultrafast laser “made in Neuchâtel” with a wide range of applications

28 June 2022

Epson Europe establishes new sales office at the Marly Innovation Center

6 April 2022

The Energypolis Campus was officially inaugurated

29 March 2022

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